Video Channel of China Shenzhen Tecircuit Electronics Limited
チャット お問い合わせ
家へ ビデオ Playlist Website

IC 基板 モバイル電話 EMMC パッケージ基板のための多層硬いPCB

その他のビデオ
January 23, 2025
Category Connection: 基板PCB
チャット お問い合わせ
タグ:
#IC基板PCBボード #IC基板印刷回路板 #モバイル電話 多層硬いPCB
Brief: Discover the IC Substrate Multilayer Rigid PCB designed for mobile phone EMMC package substrates. This high-density, durable PCB ensures optimal thermal management and signal integrity, perfect for modern smartphones. Customizable and compliant with industry standards, it supports various applications from processors to connectivity solutions.
Related Product Features:
  • High-density design accommodates numerous connections in compact spaces.
  • Effective thermal management maintains optimal operating temperatures.
  • Compact and low-profile for integration into slim mobile devices.
  • Engineered for minimal signal loss and reliable high-speed data transmission.
  • Cost-effective for high-volume production without compromising performance.
  • Durable construction withstands mechanical stress and environmental conditions.
  • Compatible with various semiconductor materials for design flexibility.
  • Customizable to meet specific application and design requirements.
FAQ:
  • What is needed for a quotation?
    For PCB: Quantity, Gerber file, and technical requirements (material, surface finish, copper thickness, board thickness, etc.). For PCBA: PCB information, BOM, and testing documents.
  • What file formats do you accept for production?
    We accept PCB Gerber files, BOM lists for PCB, and test methods for PCBA.
  • Are my files safe with you?
    Yes, your files are completely secure. We protect customer IP throughout the process and never share documents with third parties.
  • What shipment methods do you offer?
    We offer FedEx, DHL, TNT, UPS, or customer-provided shipment methods.
  • What payment methods do you accept?
    We accept Telegraphic Transfer in advance (Advance TT, T/T) and PayPal.
Related Videos